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Full-Chip Pattern Integration

Abstract

Failing tests; schedule slips; silicon respins; development tools that break with each new design. A growing number of test engineers are faced with these critical issues as they struggle with a test development process that has not kept pace with increasing device complexity. At issue is management of multiple test patterns and preparing them for production automatic test equipment (ATE). Simplistic test conversion tools, held together with ad-hoc scripts represents an outdated methodology that introduces test program errors, makes development schedules unpredictable, and can ultimately impact test quality. Many test teams have determined that a more formal approach must be applied to test pattern integration to achieve desired results in a more predictable fashion.

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